Before the resin encapsulation of semiconductors: What surface design enhances insulation and bonding strength?
A detailed explanation of specific approaches to surface treatment that are key to maximizing the quality of semiconductor resin encapsulation!
Semiconductor devices, which function as the brains of various electronic devices ranging from smartphones, automobiles, to home appliances that are essential in our daily lives, are supported by their high reliability. One of the key technologies that ensure this reliability is "resin encapsulation." The process of covering and solidifying semiconductor chips with resin is indispensable for protecting them from external environments and maintaining stable performance over long periods. However, as products require higher reliability, there are increasing cases where simply solidifying with resin is not sufficient. To fully realize the true performance of resin encapsulation, it is extremely important how well the surfaces of the semiconductor chips and substrates to be encapsulated are prepared, which is referred to as "surface design." *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*
- Company：ゼストロンジャパン
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